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This follow-up report is being submitted to relay additional information.The following sections were updated: b4, b5, d4, d9, g1, g3, g6, h1, h2, h3, h6, h11.The reported event was confirmed by review of repair record.Review of the most recent repair record determined the wire connection was not tightened at the controller board level and there was a damaged heat shrink.Controller kit replaced and resolved the reported issue.The device history record was reviewed and no discrepancies relevant to the reported event were found.Root cause has been identified as a design issue.If any further information is found which would change or alter any conclusions or information, a supplemental report will be filed accordingly.Zimmer biomet will continue to monitor for trends.
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