| Catalog Number |
10-210 |
| Medical Device Problem Code |
Material Rupture (1546)
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| Health Effect - Clinical Codes |
Wound Dehiscence (1154); Failure of Implant (1924); Impaired Healing (2378)
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| Date of Event |
09/08/2025
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Type of Reportable Event
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Serious Injury
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Event or Problem Description
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Healthcare professional reported "rupture", "delayed healing and wound dehiscence not related to the device".This record is for the right side.It was explanted and replaced.It will be returned.
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Additional Manufacturer Narrative
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A review of the device history record has been completed.No deviations or non-conformances noted.The reported events of delayed healing and wound dehiscence are physiological complications and analysis of the device generally does not assist allergan in determining a probable cause for these events.Further information from the reporter regarding event, product, or patient details has been requested.No additional information is available at this time.Reason for reoperation: rupture, delayed healing and wound dehiscence.
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Event or Problem Description
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Healthcare professional reported "rupture", "delayed healing and wound dehiscence not related to the device".This record is for the right side.It was explanted and replaced.It will be returned.
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Additional Manufacturer Narrative
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Device evaluation: per the investigation procedure, the device is analyzed through visual inspection microscopic inspection if openings are observed and a weight verification.Per the analysis performed, the assessments of the complaints and any potential manufacturing issue are displayed along with any further actions required: ¿ rupture: observed broken device through microscopic inspection assessed as fold flaw opening.No further actions are required as it is not related to the manufacturing process.¿ delayed healing-ndr: unable to observe through visual inspection as it is a physiological phenomenon.¿ wound dehiscence-ndr: unable to observe through visual inspection as it is a physiological phenomenon.None of the other observations performed during the device analysis (non-penetrating nicks) are found to be potentially related to the manufacturing process, and, therefore, no further actions are required for these observations.Reason for reoperation: rupture.
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Search Alerts/Recalls
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