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The transmitter assembly associated with the complaint was returned for investigation.Although the investigation did not replicate the alleged issue, the investigation found the rf connector was damaged due to improper/inadequate design.The sma rf connector solder joints to the pcb were cracked, partially separating the connector from the pcb and triggering the "low power detect" and/or "antenna disconnect" alarms.Thermal imaging was used to verify the outside temperature of the device while charging, the internal temperature of the device while charging, the outside temperature of the device while operating, and the internal temperature of the device while operating.Results are as follows: outside thermal temperature while charging: 32.9°c.Internal thermal temperature while charging: 42.4°c.Outside thermal temperature while operating: 29.1°c.Internal thermal temperature while operating: 31.3°c.The outside thermal temperature while charging was 32.9°c, which is below the product requirements specification of 41°c (106°f).Based on the thermal imaging, there is no evidence of thermal damage and the product met temperature specifications.Although the investigation did not replicate the alleged issue, the investigation found a broken connector (improper/inadequate design) as well as non-compliance to the ifu (user error-patient).Refer to capa: 2024-0020 for additional investigation details for the broken rf connector.Rates reviewed at the most recent complaint trending meeting do not indicate a significant increase in non-compliance to ifu.Non-compliance to ifu rates remain acceptably low; thus, capa is not required.Non-compliance to ifu rates will continue to be tracked and trended.
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