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The reported event was confirmed as manufacturing related.The product had caused the reported failure.Sample was evaluated and observed there was a pinhole on the bottom part of sac collar that allowed water to leak out.Pinhole was examined under microscope and noted to be round and smooth.A review of the manufacturing process indicates that the process can produce of this type of defect.Therefore, this failure mode confirmed manufacturing related.A potential root cause for this failure could be due to bubble during dipping process.No deviations or nonconformances related to the reported issue were identified.The labeling / packaging record review did not identify any labeling / packaging -related conditions associated with the reported failure mode.A review of the lot file showed no rejects or rework associated with this issue.For the affected date code, the rejected units were recorded as in process scrap and will be disposed of after inspection.No deviations or nonconformances related to the reported issue were identified.The dhr/bhr review did not identify any manufacturing related conditions associated with the reported failure mode.Corrections: d,e,h.Udi format updated with available product information per gudid.H11: section a through f, the information provided by bd represents all the known information at this time.Despite good faith efforts to obtain additional information, the complainant / reporter was unable or unwilling to provide any further patient, product, or procedural details to bd.
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