We received the attached study paper relating to the use of the duette multiband mucosectomy device.(dt-6, dt-6f¿) this study is a retrospective review of patient data to determine the efficacy of radiofrequency ablation (rfa) with or without endoscopic mucosal resection (emr) in the management of barrett's esophagus (be) with or without high grade dysplasia (hgd) or intramucosal adenocarcinoma (imc).This appears to be a us originated study circ.2014.(based on data from jan 2004 to dec 2012).The complaint was confirmed based on customer testimony.A lot number for the device was not provided therefore a review of the manufacturing and component records could not be completed.Due to the limited information provided by the customer, the fact that the device was not returned and given that the actual conditions of device usage could not be replicated, a definitive cause for the customers complaint could not be conclusively determined.However it should be noted that the instructions for use states the following warning regarding potential complications which includes stricture formation ; " potential complications associated with emr include, but are not limited to: retrosternal pain, nausea, laryngeal laceration, oesophageal perforation, stricture formation, obstruction, haemorrhage." it is unknown if this patient's pre existing condition was dysplastic barrett's oesophagus with high grade dysplasia or intramucosal adenocarcinoma as the study does not differentiate the two conditions regarding this occurrence.It is possible that the pre-existing condition of dysplastic barrett's oesophagus(with high grade dysplasia or intramucosal adenocarcinoma) may have contributed to the stricture formation; however this cannot be conclusively determined as a contributing factor.The most probable root cause of this event is operational context as stricture formation is listed as a known complication of emr; however this cannot be conclusively determined.Prior to distribution all duette devices are subject to visual inspection to ensure device integrity.These inspections are outlined in internal procedures in place at cook (b)(4).Complaints of this nature will continue to be monitored for potential emerging trends.
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