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Investigation - evaluation: a review of the complaint history, dimensional verification, device history record, specifications, quality control, and visual inspection of the returned device was conducted during the investigation.The micropuncture transitionless access set was returned for evaluation.Visual inspection of the returned device revealed that the guide wire was unraveled at the distal end.The solder joint was noted to be intact.The unraveled section of the wire began approximately 5 millimeters (mm) from the solder point on the distal end and extended approximately 200 mm.The intact portions of the wire guide, including diameter, were within specifications.Visual inspection of the needle noted the presence of biomatter; otherwise, the needle was in good condition.A document based evaluation was also performed.There is no evidence to suggest the product was not made to specifications.Review of device history record shows no nonconforming events on finished product which could contribute to this failure mode.It should be noted there were no other reported complaints for this lot number.Though no information was provided about whether the reported event occurred during insertion or removal of the guide wire; the design failure analysis indicates the failure most likely occurred during removal.The wire guide included is packaged with a pictograph attached to the holder that provides a warning against withdrawal of the wire guide through the entry needle.Based on the information provided and results of the investigation; however, a definitive root cause to the reported event could not conclusively be determined.We will continue to monitor for similar complaints.Per the quality engineering risk assessment no further action is required.
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