The processor pca was received for failure analysis.The reported problem was verified during lab tests.The solder contact pins common to connector j16 had lifted off the solder lands due to cold solder and/or physical stressing of the solder joints during the use of the device.The available information is consistent with a malfunction of the capacitor, case interconnect cable assembly, and processor pca.The cause of the processor pca malfunction was solder contact pins common to connector j16 had lifted off the solder lands due to cold solder and/or physical stressing of the solder joints during the use of the device.The available information from this report does not support that this malfunction represents a systemic, design, or labeling problem.No further investigation or action is warranted.
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