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Investigation - evaluation a review of the drawings, dimensional verification, device history record, documentation, instructions for use (ifu), specifications, quality control, and visual inspection of the returned device was conducted during the investigation.Review of the device history record shows no nonconforming events that would contribute to this failure mode.There were no other reported complaints for this lot number.The instructions for use advise to inspect the product upon removal from package to ensure no damage has occurred.One approach cto microwire wire guide was returned for evaluation.Inspection of the device noted the tip of the wire to be damaged and the solder tip still intact.The coil (distal) end of the wire guide was kinked.The wire guide had no notable damage and was smooth to the touch.The coil tip was intact; it was measured within specification.A definitive root cause cannot be determined.Monitoring will continue to be performed for similar complaints.Per the quality engineering risk assessment, no further action is warranted.The device has been archived at the manufacturing facility.
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