The device referenced in this report was returned to siemens for evaluation.During investigation, it was found an image artifact and the chips had overheated, confirming the reported complaint.These were due to a coax cable damage noted during the evaluation.The possible root cause of the reported complaint was due to chip damage or electrical short.A review of the device history record (dhr) was performed and there is no information to indicate any non-conformance at the time of manufacturing process.This report is resubmitted on request by the fda.
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