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(b)(4).Batch # p9242m.Investigation summary the analysis results found that an eph02 device was returned outside its original package.Only the tyvek was returned for analysis.Upon visual inspection of the tyvek, it was observed that a piece of blister was broken and still adhered tho the tyvek.Due to the damages found on the packaging, a possible cause for these conditions is due to improper handling during transit or storage; it appears that the package hit a pointy surface and this caused the reported event.All ees product is 100% inspected prior to release.The information you provided is compiled monitored and reviewed on a routine basis for any associated trends.The lot and batch history records were reviewed and no defects, ncr¿s or protocols related to the complaint, were found during the packaging process.
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