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(b)(4).Investigation summary: the analysis results found that an eph02 device was returned outside its original package.Only the tyvek was returned for analysis.Upon visual inspection of the tyvek, it was observed that a piece of blister was broken and still adhered to the tyvek.Due to the damages found on the packaging, a possible cause for these conditions is due to improper handling during transit or storage; it appears that the package hit a pointy surface and this caused the reported event.All ees product is 100% inspected prior to release.The information you provided is compiled monitored and reviewed on a routine basis for any associated trends.The lot and batch history records were reviewed and no defects, ncr¿s or protocols related to the complaint, were found during the packaging process.
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