Investigation summary: device/batch history record review: dhr review was performed on following lot number: 7076873.The product was manufactured on afa line 9 from march 24, 2017 thru march 25, 2017 and packaged on packaging line 11 from april 5, 2017 thru april 6, 2017.Per review of the dhr¿s it was concluded that all required challenges samples and testing was performed per specification in accordance with the set-up and in-process sampling plans.Per review it was noted that there were no reject activity findings throughout the build of this lot that would impact upon the quality of the product.Set-up and in-process inspections included but were not limited to blister thickness, bad seal/cut/holes, seal transfer width and package leak test.These were performed on various stages throughout the process, all the inspections passed per specifications.The peura (end user risk analysis): yes.Reason: the peura is required for all mdr reportable investigations.Findings: rm5835 rev 12 version j was analyzed to determine the risk to customer.The analysis showed that current risk is acceptable.Occurrence and severity rankings have not changed.Visual analysis: observations and testing: received one unused iag/bc 16ga unit in partially opened package from the lot number; 7076873.Visual/microscopic examination: the package was partially opened at the both ends of the blister pack.The analysis of top web adhesive: the product characteristics require a minimum of 1/8¿ seal transfer.This characteristic was met.In addition, the paper top web of the returned unit was analyzed.The analysis revealed an adequate of top web adhesive on the bottom web.The key variables that affect the packaging seal are seal transfer/width and top web adhesive presence.Both of these variables were looked at during the investigation.Investigation conclusion: relationship of device to the reported incident: indeterminate.Comment: although the packages were observed to be partially opened, there was no physical evidence to confirm or to support manufacturing process related issues for the defect.
|