|
Analysis found that the device came in with excessive blood around the seals which leaked onto the top board microprocessor which caused the failure.There were components failure and microprocessor liquid damage.The device was cleaned, replaced top board, applied rtv to connectors, applied tape, replaced 2 torn gaskets, placed into burn-in for 8 hours to check for any heat related failures and tested in accordance with manufacturing specifications.If information is provided in the future, a supplemental report will be issued.
|