Investigation: the investigation was carried out visually and microscopically with a keyence vhx-5000 digital microscope and a panasonic dmc tz8 digital camera.We made a visual inspection of the instrument.Here we found an unknown labeling.Additionally, we detected dark staining at soldering points and material erosion at the soldering ponts.We made an optical inspection of the fracture surface.No abnormalities were found.Furthermore, we discovered unknown impurities.We also found a crack and visible damage.Batch history review: the device quality and manufacturing history records have been checked for the lot number and found to be according to the specification, valid at the time of production.No similar incidents have been filed with products from this batch.Conclusion and root cause: the root cause of the problem is most probably usage related.Rationale: according to the quality standard and dhr files, a material defect and production error can be excluded.No pores or inclusions could be found on the point of rupture.Investigations lead to the assumption that the breakage and crack were caused by an improper handling due to an overload situation.There is the possibility for pre-damage or similar due to previous surgeries.The dark staining and material erosion at the soldering points could be due to chemical and electrochemical influences in connection with an excessive acid content.No capa is necessary.
|