(b)(4).Only event year known: 2019.Batch # m9035v.Device analysis: the analysis results found that mcm30 device was returned inside its package unopened.Upon visual inspection, it was observed that the tyvek from the packaging was damaged; it was noted to have a hole in the tyvek, the hole was noted to be from the outside in.Due to the damages found on the packaging, a possible cause for these conditions is due to improper handling during transit or storage; it appears that the package hit a pointy surface and this caused the reported event.The reported complaint was confirmed.All (b)(4) product is 100% inspected prior to release.The information you provided is compiled monitored and reviewed on a routine basis for any associated trends.A manufacturing record evaluation was performed for the finished device lot number m4h26w, and no non-conformances were identified.A manufacturing record evaluation was performed for the finished device batch number m9035v, and no non-conformances were identified.
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